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『協承電路板』(Century P.C. Board )
在二十年前由 Alex Wu 創立,為北美數以百計的客戶提供數百萬優質的印刷電路板。
我們的核心競爭力 : 定價理念,注重細節和一貫的客戶服務,幫助我們的眾多客戶在競爭激烈的電子製造市場中脫穎而出。
我們不斷增進製程能力,投資新設備,持續生產高品質的產品,以最快的速度完成客戶所需的訂單,並也取得AS9100航空、TS16949汽車及ISO13485醫療等認證的認可。
在二十年前由 Alex Wu 創立,為北美數以百計的客戶提供數百萬優質的印刷電路板。
我們的核心競爭力 : 定價理念,注重細節和一貫的客戶服務,幫助我們的眾多客戶在競爭激烈的電子製造市場中脫穎而出。
我們不斷增進製程能力,投資新設備,持續生產高品質的產品,以最快的速度完成客戶所需的訂單,並也取得AS9100航空、TS16949汽車及ISO13485醫療等認證的認可。
Board type: material-FR408
Laser Blind +buried vias PCB
Capability : 1+n+1
Special Request:
The Laser blind vias thru from L1 to L2, L11 to L12. the buried vias thru from L2 to L11.
The minimum trace space after compensating is 0.003 ``, the surface copper 1.0oz min.
Board type: Three-stage 3+N+3 blind via's and Class 3 PCB
Special Request:
The blind via's starts from
L1 to L2, L2 to L3, L3 to L4
The minimum blind via size 0.004 ``
Board type: The second stage blind vias and Class 3 PCB
Capability: 2+N+2
Board type: 370HR+Class 3 PCB
Special Request:
Board thickness:125mil+/- 5mil, strict tolerance
Min. hole wall thickness:1.5mil, epoxy filled and copper plating
Strict surface requirements on I/G surface finish
No scratches
Board type: Rogers and Hi-tg materials combine
Special Request:
L1~ L2 use ROGERS RO4003C material; L3~L10 use HITG material
Vacuum non-conductive epoxy fill + copper plating for all vias (VIP design)
Board type: High Aspect Ratio PCB
Special Request:
92.5mil board thickness, Through via Aspect Ratio 1: 9.3
2mil core thickness/ epoxy filled and copper plating
Function: Sales/Technical support